Powder Bed Approach to 3D Printing of Structural Electronic Circuits

The purpose of this study is to research the possibility producing structural electronics with powder bed Binder Jetting (BJ) technique. adaptation BJ ZPrinter 450 printer for deposition silver nanoparticle inks and fabrication conductive paths using commercially available consumables was successfully carried out. included testing influence different orientations printed substrates also checking dependence resistance on a number ink layers. First, measured average value equal 133.86 Ω reached after 18 nanosilver best results have been obtained 68 layers an 4.64 Ω. effect heat-treatment time multiple sintering approaches prepared samples examined. path turned out be consistent that encountered in literature. Single 33 gave 21.11 same sintered 3 times during process several passes printhead lowest 1.89 Strength tests showed not suitable application strain sensor fabrication. Despite this, high-efficiency are possible fabricated techniques, there lot room future research.